No, the electrostatic powder used to cover the solder and of BPANI nature (BPA and BPA-NI free). In fact, it has been developed to replace other substances that were identified as potentially hazardous, such as BADGE and its derivatives, and BPA (bisphenol A), which is the base material for the production of epoxy resin. BADGE and BPA-free welding shielding powders have been formulated to avoid these hazards and continue to be widely used in the industry.